TS2260 Tape Drive Model H6S驱动器
IBM System Storage TS2260 Tape Drive Express
IBM? System Storage? TS2260 Tape Drive Model H6S is designed to deliver IBM tape reliability and performance at open systems prices. Features of the new Ultrium? 6 model include:
Specification data transfer rate of up to 160 MB/sec native compared to 140 MB/sec native for Linear Tape-Open? ( LTO? ) Ultrium 5
Support for LTO Generation 6 media specification tape cartridge compressed capacity of up to 6.25 TB with 2.5 to 1 compression
The ability to read and write on Ultrium 6 and Ultrium 5 data cartridges, and read Ultrium 4 data cartridges
6 Gbps Serial Attached SCSI (SAS) attachment for Model H6S
Encryption support in the tape drive to work with application managed encryption
19-inch rack mount shelf option to accommodate two TS2260 Tape Drives side by side in the rack using just 2U of rack space
Dual SAS ports per drive to improve availability
IBM Long Term File System (LTFS) Single Drive Edition (SDE) for partitioning support
Half-high drive form factor
The TS2260 Model H6S tape drive uses a 6 Gbps dual port SAS interface for connection to a wide spectrum of system servers. The new TS2260 attaches to IBM System x? and PC servers, and selected IBM Power Systems? models. The TS2260 also supports Microsoft? Windows? , HP-UX, Oracle Solaris, and UNIX? .
The following IBM TS2260 Model H6S half-high LTO Ultrium 6 tape drive enhancements are designed to help improve performance, capacity, and reliability:
Native LTO Generation 6 media specification data transfer rate of up to 160 MB/sec
Support for LTO Generation 6 media specification tape cartridge compressed capacity of up to 6.25 TB with 2.5 to 1 compression
6 Gbps SAS attachment support
A 512 MB internal buffer
Application managed encryption support for half-high LTO Generation 6 SAS tape drives
16 KB cartridge memory with Ultrium 6 media
Half-high drive form factor
Two SAS ports per drive to improve availability and attachability
IBM LTFS partitioning support
Better integrated electronics using IBM engineered copper technology